Author: Yulin Wang, Senior Technology Analyst at IDTechEx Thermal Design Power Trend As of 2024, single-phase direct-to-chip (D2C) cooling dominates the high-end GPU thermal management market. However, with the increasing thermal design power (TDP), two-phase D2C cooling will be required, and it is expected to come in large volume no earlier than 2026 and 2027. IDTechEx has interviewed a large number of players in the data center value chain, ranging from chip makers, cold plate suppliers, and system integrators. Despite different opinions on the exact timeline, the consensus is…
Read MoreDay: 5 November 2024
Exploring the Equipment Management of Smart Buildings: A Tour of the Minato MIRAI Innovation Center Machine Room
The Murata Manufacturing Minato MIRAI Innovation Center located in Kanagawa Prefecture is a smart building that realizes comfort, energy conservation, and safety through the use of IoT technologies, and the equipment that supports that functionality is to be found in the basement. In this article, Haga, who is in charge of equipment management at the center, and Yamamoto, who is in charge of sales at the Tokyo branch office, tell us about the various technologies employed in the machine room and central control room, which together can be thought of…
Read MoreNORD Drivesystems, More than just energy-efficient
More than just energy-efficient IE5+ synchronous motors from NORD DRIVESYSTEMS NORD-IE5plus-Motor.jpg: The IE5+ synchronous motors from NORD are especially sustainable because of their energy and material efficiency Image: NORD DRIVESYSTEMSAccording to the German Environment Agency, electric drives in the industry and trade sectors consume nearly two fifths of the total electricity in Germany. Particularly electric drives and the aggregates powered by them therefore have a great and economic energy saving potential. With its highly efficient latest-generation IE5+ motors, system provider NORD DRIVESYSTEMS offers an optimum solution for the significant reduction of energy and resource consumptions.The compact…
Read MoreSupriya Lifescience Ltd. Reports Strong Q2 FY25 Growth with 19% YoY Revenue Increase
The unaudited financial statements for the Q2FY25 results have been released by Supriya Lifescience Ltd., a cGMP-compliant business with a strong track record in API manufacturing and a focus on products from a variety of therapeutic segments, including anti-histamine, anti-allergic, vitamin, anaesthetic, and anti-asthmatic. The company has spread its business in more than 86 countries across the globe. Key Consolidated Financial Highlights for Q2FY25: Particulars Q2 FY25 Q2 FY24 Y-o-Y Revenues (in Rs Cr) Rs. 166.1 Rs. 140.1 18.6% Gross Profit (in Rs Cr) Rs. 120.13 Rs.78.46 53.1%…
Read MoreSAIL signs MoU with ASCI Hyderabad for academic collaboration
Steel Authority of India Limited (SAIL) has recently entered into a Memorandum of Understanding (MoU) with the Administrative Staff College of India (ASCI) located in Hyderabad. This strategic collaboration is aimed at enhancing academic engagement between the two institutions, particularly through tailored Management Development Programs for SAIL’s newly promoted executives1 and other professional development initiatives. The signing of the MoU took place in New Delhi on November 4, 2024, and was attended by key figures including KK Singh, Director (Personnel) of SAIL, and Dr. Nirmalya Bagchi, Director of ASCI. This…
Read MoreLaunches of Rs 187 crore worth projects in Chennai
Union Minister Shri Sarbananda Sonowal recently inaugurated several key infrastructure projects at the Chennai Port Authority and Kamarajar Port, with a combined investment totaling approximately Rs. 187.33 crores. This initiative is part of an effort to enhance trade efficiency, sustainability, and operational capabilities at these critical maritime hubs, which are integral to India’s global trade framework. Union Minister emphasized that these projects are crucial for modernizing India’s ports and enhancing maritime connectivity, which is essential for harnessing India’s potential as a significant player in global trade. He remarked on the…
Read MoreEmerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging Technologies
Author: Dr Yu-Han Chang, Principal Technology Analyst at IDTechEx Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance computing (HPC). This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers. The insights are derived from IDTechEx's recent report, “Advanced Semiconductor Packaging 2025-2035: Forecasts, Technologies, Applications“, which delves deep into understanding the technical aspects of packaging technologies, examining industry challenges, the progress made by leading…
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